Wafer thinning and wafer backgrinding service
Wafer Thinning of Semiconductor Wafers
The Valley Design Advantage - Wafer thinning experience spanning over 30 years, hundreds of customers, thousands of successfully completed wafer thinning jobs on numerous types of wafers.
Wafer thinning and backgrinding services: (abrasive lapping or Disco backgrinding)
Single sided wafer thinning:
Valley Design's wafer thinning method protects the process side of the wafer which often has various structures or devices already there. After stock thickness reduction step is performed, CMP is used to remove a minimum of 25 microns (.001"/ 1 mil), eliminating sub-surface damage (SSD).
Available surface finishes on backside:
Various materials thinned:
Please call or e-mail for a quotation to meet your requirements.
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Valley Design East
Phoenix Park Business Center
2 Shaker Road, Bldg. E-001
Shirley, MA 01464
Valley Design West
Santa Cruz, CA 95060