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Wafer Thinning of Semiconductor Wafers
The Valley Design Advantage - Wafer thinning experience spanning over 50 years, hundreds of customers, thousands of successfully completed wafer thinning jobs on numerous types of wafers.
Wafer thinning and backgrinding services: (abrasive lapping or Disco backgrinding)
- Thinning from partial wafer sections up to 300mm diameter wafers
- Bumped wafers
- Single die thinning
- Ultra-thin wafers 100mm (4″) diameter down to 25 microns (.001″/ 1 mil); 200mm (8″) diameter down to 50 microns (.002″/ 2 mils)
- Bonded wafers
- Anodic bonded wafers Silicon on Pyrex, one side to 10 microns
Single sided wafer thinning:
Valley Design’s wafer thinning method protects the process side of the wafer which often has various structures or devices already there. After stock thickness reduction step is performed, CMP is used to remove a minimum of 25 microns (.001″/ 1 mil), eliminating sub-surface damage (SSD).
Available surface finishes on backside:
- Ground Finish 25u” Ra < 250 Angstroms
- Stress relief polish < 250 Angstroms
- 10 Angstrom Ra polish
- 7 Angstrom Ra polish
- < 5 Angstrom Ra polish
Various materials thinned:
- InGaAs, Indium Phosphide, Silicon, Germanium, Gallium Arsenide
- Ceramics, Glass, Stainless Steel, Sapphire
Please call or e-mail for a quotation to meet your requirements.
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