Silicon wafer polishing to tightest tolerances possible
Ultimate in Flat and Parallel Polished Wafers
Silicon wafers with TTV less than 1 micron are now possible, but not inexpensive. Even on fairly thin wafers, Valley Design can achieve flatness (bow and warp) of less the 5 microns.
At present, Valley Design can process wafers up to 14" in diameter, and we offer surface finish as low as 2-3 Angstroms.
For state-of-the-art semiconductor wafers, we believe, that if you can think it, we can do it. Try us!
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Valley Design East
Phoenix Park Business Center
2 Shaker Road, Bldg. E-001
Shirley, MA 01464
Valley Design West
Santa Cruz, CA 95060