Ultimate in Flat and Parallel Polished Wafers
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Advanced Search Powered by KSearch 1.5b Ultimate in Flat and Parallel Polished WafersSilicon wafers with TTV less than 1 micron are now possible, but not inexpensive. Even on fairly thin wafers, Valley Design can achieve flatness (bow and warp) of less the 5 microns.At present, Valley Design can process wafers up to 14" in diameter, and we offer surface finish as low as 2-3 Angstroms. For state-of-the-art semiconductor wafers, we believe, that if you can think it, we can do it. Try us! Return to Home Page: Polished silicon wafers and polishing services Updated: 27 May 2010 |
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