Ultimate in Flat and Parallel Polished Wafers

Silicon wafers with TTV less than 1 micron are now possible, but not inexpensive. Even on fairly thin wafers, Valley Design can achieve flatness (bow and warp) of less the 5 microns.

At present, Valley Design can process wafers up to 14" in diameter, and we offer surface finish as low as 2-3 Angstroms.

For state-of-the-art semiconductor wafers, we believe, that if you can think it, we can do it. Try us!

Return to Home Page: Polished silicon wafers and polishing services

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Return to top of page		Updated: 6 May 2008
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