Silicon Wafers and Silicon Ingots

Silicon wafers polished to a mirror finish are available from stock up to 150 mm (6") in diameter.

Custom polished Silicon wafers, even over 300 mm (12") in diameter, 100 mm (4") Silicon slices as thin as 4 mils are available - frequently from stock.

Other Services:

• Ingot orientation
• Ingot grinding to diameter
• Orientation - flat grinding
• Ingot etching
• Crystal wafering - slicing into thin wafers
• Edge rounding
• Wafer lapping
• Wafer etching - acid or base
• Polishing
• Cleaning
• Packaging - clean room

Silicon wafer dicing related Web sites:

• www.semi.org SEMI Semiconductor Equipment and Materials International
• www.customdicing.com/sitemap.htm Wafer custom dicing
• www.edgepolishing.com/sitemap.htm Edge and angle polishing
• www.laserslag.com/sitemap.htm Substrate chamfering

Return to Home Page: Polished silicon wafers and polishing services

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Return to top of page		Updated: 6 May 2008
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