Semiconductor Material Wafer Backgrinding

Semiconductor Material Wafer Backgrinding

• Double side polished wafers to TTV < 1 micron
• Silicon, Germanium, Gallium Arsenide, Gallium Phosphide, wafer shaping
• Slicing to 5" diameter
• Wafer edge grinding
• Lapping to 300 mm diameter wafers
• Wafer backgrinding, lapping, polishing
• Dicing to 6" diameter
• Optical grade materials from stock
• Cylindrical grinding
• Wafer thinning
• Flattening
• Complex wafer shaping
• Surface flat orientation
• Testing for type and resistivity
• Downsizing
• Process development and R & D

Request a quotation for all your backgrinding, polishing and special semiconductor material shaping needs!

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Updated: 19 October 2010

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