Silicon Wafers: As Cut, Lapped, Etched, or Polished

FZ and CZ Silicon wafers in all sizes, orientations, and resistivities are processed in the USA, from small evaluation quantities to thousands of wafers.

Whether you need a single 25 mm diameter wafer 50 microns thick or 1000 wafers of 100mm Silicon polished on both sides to a thickness of 100 microns with TTV of 2½ microns, your requirements can be met.

Capabilities:

• SOI wafer polishing
• MEMS wafer polishing
• Glass and Silicon wafers for anodic bonding
• Backside and Double side Polishing
• Edge and angle polishing
• FZ Wafers and Ingots from stock
• Extremely Thin Wafers
• Germanium Wafers
• Your Custom Requirements

Return to Home Page: Polished silicon wafers and polishing services

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Return to top of page		Updated: 6 May 2008
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