Fused Silica Wafers, Substrates, and Windows

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Polished Fused Silica plates with a 40/20 finish are economically priced and deliveries are excellent, frequently from stock.

Commonly available sizes of Fused Silica wafers, substrates and plates include 6"x6" x 0.120" thick, 5" square x 0.090", 5" square x 0.180", 5" square x 0.250", 6" square x 0.150, 6" square x 0.250", and 7.25" diameter x 0.150" thick with 1.00" flats on each side. Very high quality surface finishes are also available up to 10/5 scratch/dig (< 7 Angstroms) and better.

Key properties of Fused Silica (SiO2) include near zero thermal expansion, very good thermal shock resistance and chemical inertness, low dielectric constant and dielectric loss, and excellent transmission in the UV and visible ranges. These properties make polished Fused Silica wafers and substrates ideal for thermal imaging, microlithography, Excimer and Nd: YAG laser applications. Lenses and windows of Fused Silica are also used in highly variable temperature environments as well as for microwave and millimeter wave components.

Valley Design is an ISO 9002 Certified company, supplying lapping, thinning, polishing, wafering, and dicing services for optics, photonics, semiconductor, aerospace and medical industries. Valley manufactures wafers, windows, substrates and other flat electro and electro-optical components. Sapphire, Quartz, Silicon, Aluminas, Glass, and many other materials processed.

Other products offered by Valley Design:
Metal Optics - www.precision-metal-optics.com
Stainless Steel Wafers - www.stainless-steel-wafers.com
Metal Mirrors - www.precision-metal-optics.com/metal-mirror-diagram.htm

100mm Silicon Wafers CMP Polishing Dicing Edge Rounding Feedback Fused Quartz FZ Silicon Wafers FZ Wafers High Purity FZ Silicon NTD Silicon Optical Glass Optical Grade Silicon Optical Technology Polished FZ Silicon Sapphire SEMI Materials Shaping Silicon Lapped/Etched Silicon Wafers Thin Silicon Tight Tolerances Vacuum Chucks Wafer Chucks Wafer Polishing Wafer Thinning

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