For critical applications in:
Unique services provided include edge/angle polishing, precision dicing, fiber array polishing, ultra-thin components, tight tolerances, super finishes (< 10/5 scratch-dig), long rod end polishing, IC die thinning and other hard to find state-of-the-art solutions. Fused quartz wafers are also available in 300mm diameter to SEMI specifications. Many other sizes are available from stock. Please call or e-mail for a quotation to meet your requirements.
Return to Home Page: Polished silicon wafers and polishing services
100mm Silicon Wafers CMP Polishing Dicing Edge Rounding Feedback Fused Silica Substrates FZ Silicon Wafers FZ Wafers High Purity FZ Silicon NTD Silicon Optical Glass Optical Grade Silicon Optical Technology Polished FZ Silicon Sapphire SEMI Materials Shaping Silicon Lapped/Etched Silicon Wafers Thin Silicon Tight Tolerances Vacuum Chucks Wafer Chucks Wafer Polishing Wafer Thinning
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Corporate Headquarters |
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Valley Design West 151-D Harvey West Blvd. Santa Cruz, CA 95060 |
Affiliate Sites |
Valley Design East Two Shaker Road, Bldg. E-001 Shirley, MA 01464 |
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West E-mail:
west@siliconwafers.net Germany Sales: germany@valleydesign.com France Sales: france@valleydesign.com Phone: 831.420.0595 Fax: 831.420.0592 |
East E-mail:
east@siliconwafers.net Germany Sales: germany@valleydesign.com France Sales: france@valleydesign.com Phone: 978.425.3030 Fax: 978.425.3031 |
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Updated: 6 May 2008 |
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