Fused Quartz and Fused Silica

Wafers, substrates, windows and plates from fused quartz polished to sub-nanometer surface finishes and can be verified by Valley's in-house WYKO non-contact optical interferometer.

For critical applications in:

• Fused quartz and fused silica flat optical components
• WDM
• DWDM
• MEMS
• Ultra-thin fused quartz
• Silicon-on-insulator

Unique services provided include edge/angle polishing, precision dicing, fiber array polishing, ultra-thin components, tight tolerances, super finishes (< 10/5 scratch-dig), long rod end polishing, IC die thinning and other hard to find state-of-the-art solutions. Fused quartz wafers are also available in 300mm diameter to SEMI specifications. Many other sizes are available from stock. Please call or e-mail for a quotation to meet your requirements.

Fused quartz, fused silica and MEMS related web sites:

• www.quartz-silica.net Fused silica fused quartz substrates and wafers
• www.ultra-thin.com/mems.htm MEMS and bonded SOI ultra-thin silicon wafers
• www.customdicing.com Dicing hybrid semiconductor and MEMS circuits
• www.valleydesign.com/7940.htm Properties of Corning 7980 Fused Silica

Return to Home Page: Polished silicon wafers and polishing services

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