Substrate Chamfering and Edge Rounding

A proprietary process has been developed utilizing precisely graded pure Aluminum Oxide micro-abrasive powder as the vehicle for laser slag removal and edge rounding on substrates and laser holes.

By various masking techniques, more material can be removed from one side than from the other, and on substrate edges, it is possible to round one or more edges and leave other edges sharp. The degree of rounding is controllable as well. This process can be used to clean slag from either or both sides of lasered parts and to chamfer square or round holes or any shapes. Each of these benefits is available without the usual risks associated with high velocity blasting techniques. This process is adaptable to most materials including 99.6%, AlN, BeO, Fused Silica, Quartz, Glass and various other hard and semi-hard materials.

The company's capabilities include complete service for edge shaping, squaring and polishing on most materials including the smallest semiconductor and optical dice.

For more information on the following Web sites:

• www.siliconwafers.net/dicing.htm Precision dicing
• www.siliconwafers.net/thinned.htm Silicon wafers thinned to produce thinner dice
• www.edgepolishing.com/sitemap.htm Listing of Web pages on Edge Polishing domain
• www.laserslag.com Lasered substrate edge and hole deburring
• www.ultra-thin.com/sitemap.htm Ultra thin glass, wafer and chip site map

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