Precision wafer dicing
Precision Silicon Wafer Dicing
Precision Silicon wafer dicing services are provided for R & D, prototype, as well as high volume contract dicing.
State-of-art dicing saws are fully programmable and equipped with microscope and video for precision alignment. We offer accurate dicing for silicon wafers up to 6" in diameter ESD protected when required.
Depending upon the material, the dicing kerf may be as small as 1 mil and die size as small as 5 mils square. Partial cut and break services or 100% saw through on tape or other carrier are available.
Services include slotting, cutting through layered assemblies like Silicon-on-Glass, machining grooves, Sapphire and Glass.
For damaged damaged Disco and K & S wafer chuck repair service, click here.
For Precision Dicing, Do You Need a Quick Quotation?
Whether you require dicing or cutting of standard materials like Silicon and Quartz, or you need to develop dicing and cutting procedures for untried materials, Customer Service will work with you to achieve your quality and product goals.
Silicon wafer dicing related Web sites:
Return to Home Page: Polished silicon wafers and polishing services
Valley Design East
Phoenix Park Business Center
2 Shaker Road, Bldg. E-001
Shirley, MA 01464
Valley Design West
Santa Cruz, CA 95060