CMP Semiconductor Wafer Polishing

Custom wafer polishing has been the company's specialty for over 25 years. From 3 mm optical windows to 300 mm Silicon wafers double side polished are all part of past experience.

• Double side polished wafers to TTV < 1 micro-meter
• Flatness (bow and warp) of less than 5 micro-meters
• Surface finish as low as 2-3 Angstroms Ra is possible
• 100 mm diameter only 50 micro-meters thick - no problem
• Cut, lap, etch, and polish
• Class 10 cleanroom inspection and packaging
• Wafer dicing up to 150 mm
• Edge rounding
• SOI wafer thinning and polishing

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