Thinning and polishing Anodic Bonded wafers for MEMS

Bonded Wafer Thinning and SOI CMP Polishing

Do you have a problem getting good yields when:

  • Thinning and polishing Silicon wafers to 150 micron thickness?
  • Polishing SOI wafers and anodic boned wafers to micron tolerances?

It takes the right equipment, the right process, and trained personnel.

The company is ISO certified and has been custom polishing semiconductor and optical materials for over 25 years.

We have the right processes and trained personnel.

Please note that we can also polish all your semiconductor wafers. We are polishing people making and using polishing machines.

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